IPC-7351B Electronic Component Zero Orientation [pdf] (2010)

AppNote 10831 IPC-7351B Electronic Component Zero Orientation For CAD Library Construction A P P N O T E S SM Copyright © 2010 Mentor Graphics Corporation Trademarks that appear in Mentor Graphics product publications that are not owned by Mentor Graphics are trademarks of their respective owners. Component Orientations INTRODUCTION CONTENTS 1 INTRODUCTION ............................................................................................................ 1 1.1 Scope ................................................................................................................... 1 1.2 Purpose ................................................................................................................ 1 2 CHIP COMPONENTS ..................................................................................................... 3 2.1 Chip Capacitor ...................................................................................................... 3 2.2 Chip Resistor ........................................................................................................ 3 2.3 Chip Inductor ........................................................................................................ 3 3 MOLDED COMPONENTS ............................................................................................... 4 3.1 Molded Capacitors ................................................................................................ 4 3.2 Molded Diodes ...................................................................................................... 4 3.3 Molded Inductors ................................................................................................... 4 4 PRECSION WIRE-WOUND ............................................................................................ 5 4.1 Precision Wire Wound Components ....................................................................... 5 5 MELF COMPONENTS .................................................................................................... 6 5.1 MELF Diodes ........................................................................................................ 6 5.2 MELF Resistors ..................................................................................................... 6 6 ALUMINUM ELECTROLYTIC CAPACITORS ................................................................... 8 6.1 Aluminum Electrolytic Capacitors ........................................................................... 8 7 SOT COMPONENTS ...................................................................................................... 9 7.1 SOT23-3 ............................................................................................................... 9 7.2 SOT23-5 ............................................................................................................... 9 7.3 SOT343 ................................................................................................................ 9 7.4 SOT223 ................................................................................................................ 9 8 TO COMPONENTS ...................................................................................................... 10 8.1 TO252 (DPAK) .................................................................................................... 10 9 SMALL OUTLINE GULLWING COMPONENT ................................................................ 11 9.1 SOIC, SOP & SSOP ............................................................................................ 11 9.2 TSSOP ............................................................................................................... 11 10 SMALL OUTLINE J-LEAD COMPONENTS .................................................................... 12 10.1 SOIC J-Lead ....................................................................................................... 12 11 QUAD FLAT PACKAGE ................................................................................................ 13 11.1 Square QFP Pin 1 on Side ................................................................................... 13 11.2 Rectangle QFP Pin 1 on Side .............................................................................. 13 12 BUMPER QUAD FLAT PACKAGE ................................................................................. 14 12.1 Bump QFP Pin 1 on Side ..................................................................................... 14 12.2 Bump QFP Pin 1 in Center .................................................................................. 14 13 CERAMIC FLAT PACKAGE .......................................................................................... 15 13.1 Ceramic Flat Package ......................................................................................... 15 14 CERAMIC QUAD FLAT PACKAGE ............................................................................... 16 14.1 CQFP (Ceramic Quad Flat Package) ................................................................... 16 15 PLASTIC LEADED CHIP CARRIERS ............................................................................ 17 i Component Orientations INTRODUCTION ii 15.1 PLCC Square ...................................................................................................... 17 15.2 PLCC Rectangular .............................................................................................. 17 16 LEADLESS CHIP CARRIERS ....................................................................................... 18 16.1 LCC Square ........................................................................................................ 18 17 QUAD FLAT NO-LEAD ................................................................................................. 19 17.1 QFN Square ........................................................................................................ 19 17.2 QFN Rectangular Vertical .................................................................................... 19 17.3 QFN Rectangular Horizontal ................................................................................ 19 18 BALL GRID ARRAY ...................................................................................................... 20 18.1 BGA Square ........................................................................................................ 20 18.2 BGA Rectangular ................................................................................................ 20 19 COMPONENT ZERO ORIENTATIONS .......................................................................... 21 19.1 Summary ............................................................................................................ 21 Component Orientations INTRODUCTION 1 INTRODUCTION 1.1 Scope To establish a consistent technique for the description of electronic component orientation, and their land pattern geometries, that facilitates and encourages a common data capture and transfer methodology amongst and between global trading partners. 1.2 Purpose IPC, in conjunction with the International Electrotechnical Commission (IEC), have established several standards that are in the process of being coordinated. One of the standards is on the design of land patterns geometries (IPC-7351/IEC 61188-5-1); the other set is on electronic description for data transfer between design and manufacturing (IPC-2581/IEC 61182-2). In order to maintain a consistent method where these two important standards describe the component mechanical outlines, and their respective mounting platforms, a single concept must be developed that takes into account various factors within the global community. One of these factors is that of establishing a CAD component description and land pattern standard that adopts a fixed Zero Component Orientation so that all CAD images are built with the same rotation for the purpose of assembly machine automation. The land pattern standards clearly define all the properties necessary for standardization and acceptability of a “One World CAD Library”. The main objective in defining a one world CAD library is to achieve the highest level of “Electronic Product Development Automation”. This encompasses all the processes involved from engineering to PCB layout to fabrication, assembly and test. The data format standards need this type of consistency in order to meet the efficiency that electronic data transfer can bring to the industry. Many large firms have spent millions of dollars creating and implementing their own unique standards for their own “Electronic Product Development Automation”. These standards are proprietary to each firm and are not openly shared with the rest of the industry. This has resulted in massive duplication of effort costing the industry millions of man hours in waste and creating industry chaos and global non- standardization. The industry associations responsible for component descriptions and tape and reel orientation have tried valiantly to influence the industry by making good standards that describe the component outlines and how they should be positioned in the delivery system to the equipment on the manufacturing floor. Suppliers of parts have either not adhered to the recommendations or have misunderstood the intent and provided their products in different orientations. The Land pattern standards (both IPC-7351 and IEC 61188-5-1) put an end to the “Proprietary Intellectual Property” and introduce a world standard so every electronics firm can benefit from Electronic Product Development Automation. The data format standards (IPC-2581 and IEC 61182-2) are an open database XML software code that is neutral to all the various CAD ASCII formats. For true machine automation to exist, the world desperately needs a neutral CAD database format that all PCB manufacturing machines can read. The main